ISM330DHCX

iNEMO惯性模块：始终开启3D加速度计和3D陀螺仪，具有数字输出，用于工业应用

描述

The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.
All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.
An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.
The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.

• 所有功能

• Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors

• Machine Learning Core

• Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click

• Embedded pedometer, step detector and counter for healthcare applications

• Analog supply voltage: 1.71 V to 3.6 V

• Embedded temperature sensor

• Embedded self-test both for gyroscope and accelerometer

• High shock survivability

• ECOPACK, RoHS and “Green” compliant

• 
  

• 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g

• 3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps

• Extended temperature range from -40 to +105 °C

• Embedded compensation for high stability over temperature

• SPI/I?C serial interface

• Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)

• Six-channel synchronized output

• Sensor hub feature to efficiently collect data from additional external sensors

• Embedded smart FIFO up to 9 kbytes

iNEMO?惯性模块是惯性测量单元（IMU），整合了补充类型的传感器，提供了比分立式MEMS产品更小巧、稳定且易于组装的解决方案。

iNEMO?系统级封装（SiP）在6轴或9轴单片式解决方案内整合了加速器、陀螺仪和磁力计。

为了在系统层面进一步节电，我们设计了iNEMO 惯性模块（内嵌机器学习内核）。MLC运行一个传感器内置的分类引擎，卸载主处理器的负荷以运行不同的任务，或者让主处理器进入睡眠状态以节电，同时内置的传感器可以识别运动数据。

多个传感器输出的集成令运动传感系统的精度达到了的应用要求，如增强的手势识别、游戏、增强实境、室内导航和基于本地化的服务